Tesla Dojo 3 Will Be 2 Nanometer Chips Supplied by Samsung with Intel Packaging
by Brian Wang from NextBigFuture.com on (#6Z61Q)
Tesla plans to split Dojo 3 chip production, with Samsung handling front-end manufacturing and Intel taking on specialized packaging. This is a move away from TSMC's full-process control. Samsung's foundry to produce D3 chips will use the 2nm process for Tesla's AI6 and Dojo 3. Intel will use leverage EMIB 2.5D packaging for Dojo's large-scale ...