First Tesla Will Recursively Improve Chip Masks for AI5, AI6 and Other Chips
by Brian Wang from NextBigFuture.com on (#74DPR)
TERAFAB project, which will be done jointly by @SpaceX and @Tesla. The goal is to produce over a TERAWATT of compute per year (logic, memory & packaging) with ~80% for space and ~20% for the ground. The goal is extreme vertical integration to produce custom AI chips (logic, memory, and advanced packaging) at massive scale: ...