Article H3GB Samsung barks out the orders, reveals its 3D flash lead

Samsung barks out the orders, reveals its 3D flash lead

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from The Register on (#H3GB)
Story ImageMicron, SanDisk, Tosh are so far behind the sweet 16 layers

The top dog in the flash industry has just barked out loud and strong; emphasising its 3D flash process lead, Samsung is mass-producing 48-layer, 256Gbit 3D NAND chips, essentially tech SanDisk/Toshiba is hopeful of shipping next year."

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